Thermal Paste Injection Higher Performance, Original Quality, Use in Coolers Heat Sink for CPU and Chipsets

Product codecpu-cooling-paste-injection
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* Generally used as a thermal coupling of electrical / electronic devices to heat sinks such as base or mounting
studs of transistors, diodes and rectifiers
* It is used for maintaining a positive heat-sink seal that improves heat transfer from the electrical /
electronic component / device to the heat sink or chassis, there by increasing the overall efficiency of the
component / device
* High thermal conductivity low thermal resistance electrically non-conductive, non-curing, non-capacitive, non-
corrosive bleed resistant temp resistant from -50 to 210 C

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Additional information

Weight 0.030 kg
Dimensions 10 × 9 × 4 cm



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